검색결과 : 12건
| No. | Article |
|---|---|
| 1 |
DCIR3 and DCIR4 are co-expressed on inflammatory and patrolling monocytes Hsu Y, Okada R, Nishimura T, Kawasaki N, Yamamoto K, Matsumoto N Biochemical and Biophysical Research Communications, 494(3-4), 440, 2017 |
| 2 |
Influence of cooling rate on alternating current light-emitting diode with multiple quantum wells Lee SL, Cheng CH, Ku CH, Hsu Y International Journal of Heat and Mass Transfer, 85, 455, 2015 |
| 3 |
Automatic calibration of stratigraphic forward models for predicting reservoir presence in exploration Falivene O, Frascati A, Gesbert S, Pickens J, Hsu Y, Rovira A AAPG Bulletin, 98(9), 1811, 2014 |
| 4 |
Acyl and Silyl Group Effects in Reactivity-Based One-Pot Glycosylation: Synthesis of Embryonic Stem Cell Surface Carbohydrates Lc(4) and IV(2)Fuc-Lc(4) Hsu Y, Lu XA, Zulueta MML, Tsai CM, Lin KI, Hung SC, Wong CH Journal of the American Chemical Society, 134(10), 4549, 2012 |
| 5 |
Optimization of microcolumn electron optics for high-current applications Mankos M, Lee KY, Muray L, Spallas J, Hsu Y, Stebler C, DeVore W, Bullock E, Chang THP Journal of Vacuum Science & Technology B, 18(6), 3057, 2000 |
| 6 |
Advances in arrayed microcolumn lithography Muray LP, Spallas JP, Stebler C, Lee K, Mankos M, Hsu Y, Gmur M, Chang THP Journal of Vacuum Science & Technology B, 18(6), 3099, 2000 |
| 7 |
1 kV resist technology for microcolumn-based electron-beam lithography Lee KY, Hsu Y, Le P, Tan ZCH, Chang THP, Elian K Journal of Vacuum Science & Technology B, 18(6), 3408, 2000 |
| 8 |
Polishing parameter dependencies and surface oxidation of chemical mechanical polishing of Al thin films Wrschka P, Hernandez J, Hsu Y, Kuan TS, Oehrlein GS, Sun HJ, Hansen DA, King J, Fury MA Journal of the Electrochemical Society, 146(7), 2689, 1999 |
| 9 |
Chemical mechanical polishing of Al and SiO2 thin films: The role of consumables Hernandez J, Wrschka P, Hsu Y, Kuan TS, Oehrlein GS, Sun HJ, Hansen DA, King J, Fury MA Journal of the Electrochemical Society, 146(12), 4647, 1999 |
| 10 |
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching Hsu Y, Standaert TEFM, Oehrlein GS, Kuan TS, Sayre E, Rose K, Lee KY, Rossnagel SM Journal of Vacuum Science & Technology B, 16(6), 3344, 1998 |