검색결과 : 25건
| No. | Article |
|---|---|
| 1 |
Vertebrate diapause preserves organisms long term through Polycomb complex members Hu CK, Wang W, Brind'Amour J, Singh PP, Reeves GA, Lorincz MC, Alvarado AS, Brunet A Science, 367(6480), 870, 2020 |
| 2 |
Changes in regeneration-responsive enhancers shape regenerative capacities in vertebrates Wang W, Hu CK, Zeng A, Alegre D, Hu DQ, Gotting K, Granillo AO, Wang YF, Robb S, Schnittker R, Zhang SS, Alegre D, Li H, Ross E, Zhang N, Brunet A, Alvarado AS Science, 369(6508), 1207, 2020 |
| 3 |
Impact of Mutations at C-Terminus on Structures and Dynamics of A beta 40 and A beta 42: A Molecular Simulation Study Linh NH, Thu TTM, Tu L, Hu CK, Li MS Journal of Physical Chemistry B, 121(17), 4341, 2017 |
| 4 |
Second derivative techniques in differential scanning calorimetry of DNA modified with platinum compounds Chang CL, Chen CC, Hu CK, Lando DY Thermochimica Acta, 654, 186, 2017 |
| 5 |
Effect of Taiwan Mutation (D7H) on Structures of Amyloid-beta Peptides: Replica Exchange Molecular Dynamics Study Truong PM, Viet MH, Nguyen PH, Hu CK, Li MS Journal of Physical Chemistry B, 118(30), 8972, 2014 |
| 6 |
Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects Kelly J, Nogami T, van der Straten O, Demarest J, Li J, Penny C, Vo T, Parks C, Dehaven P, Hu CK, Liniger E Journal of the Electrochemical Society, 159(10), D563, 2012 |
| 7 |
Medium Optimization for Improved Ethanol Production in Very High Gravity Fermentation Hu CK, Qin Q, Gao PP Chinese Journal of Chemical Engineering, 19(6), 1017, 2011 |
| 8 |
Thermal Stability of Copper Contact Metallization Using Ru-Containing Liner Seo SC, Yang CC, Hu CK, Kerber A, Fan S, Horak D, Canaperi D, Rao SP, Haran B, Doris B Electrochemical and Solid State Letters, 14(5), H187, 2011 |
| 9 |
Sample-to-Sample Fluctuations in Heterogeneous DNA Gevorkian ZS, Mai SL, Hu CK Journal of Polymer Science Part B: Polymer Physics, 48(23), 2432, 2010 |
| 10 |
Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface Ryan ET, Martin J, Bonilla G, Molis S, Spooner T, Widodo J, Kim JH, Liniger E, Grill A, Hu CK Journal of the Electrochemical Society, 154(7), H604, 2007 |