화학공학소재연구정보센터
검색결과 : 9건
No. Article
1 Ti1-xSnxO2 nanofilms: Layer-by-layer deposition with extended Sn solubility and characterization
Yong ZH, Linghu JJ, Xi SB, Tan HR, Shen L, Yang P, Hui HK, Cao JQ, Leek ML, Yin XM, Feng YP, Pan JS
Applied Surface Science, 428, 710, 2018
2 Improvement in Photovoltaic Performance of Thin Film beta-FeSi2/Si Heterojunction Solar Cells with Al Interlayer
Liew SL, Chai Y, Tan HR, Hui HK, Wong ASW, Dalapati GK, Chi DZ
Journal of the Electrochemical Society, 159(1), H52, 2012
3 Sputter-Deposited La2O3 on p-GaAs for Gate Dielectric Applications
Das T, Mahata C, Maiti CK, Dalapati GK, Chia CK, Chi DZ, Chiam SY, Seng HL, Tan CC, Hui HK, Sutradhar G, Bose PK
Journal of the Electrochemical Society, 159(2), G15, 2012
4 Thin-film InGaN/GaN Vertical Light Emitting Diodes Using GaN on Silicon-On-Insulator Substrates
Bin Dolmanan S, Teo SL, Lin VK, Hui HK, Dadgar A, Krost A, Tripathy S
Electrochemical and Solid State Letters, 14(11), H460, 2011
5 Structural and optical properties of InAs bilayer quantum dots grown at constant growth rate and temperature
Ngo CY, Yoon SF, Tanoto H, Hui HK, Lim DR, Wong V, Chua SJ
Journal of Crystal Growth, 323(1), 167, 2011
6 Direct transfer of gold nanoislands from a MoS2 stamp to a Si-H surface
Deng J, Troadec C, Hui HK, Joachim C
Journal of Vacuum Science & Technology B, 28(3), 484, 2010
7 Novel planarizing scheme for patterned media
Poh WCA, Tan HK, Ong LT, Hui HK, Wong SK, Aung KO, Tan E, Sbiaa R, Kay YS, Piramanayagam SN
Journal of Vacuum Science & Technology B, 28(4), 806, 2010
8 Multiplexing frequency mode study of packaging epoxy molding compounds using dynamic mechanical analysis
Tsang CF, Hui HK
Thermochimica Acta, 367-368, 93, 2001
9 An alternative method to the curing study of polymeric die attach adhesives using dynamic mechanical analysis
Tsang CF, Hui HK
Thermochimica Acta, 367-368, 169, 2001