검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
On the role of halides and thiols in additive-assisted copper electroplating Huynh TMT, Weiss F, Hai NTM, Reckien W, Bredow T, Fluegel A, Arnold M, Mayer D, Keller H, Broekmann P Electrochimica Acta, 89, 537, 2013 |
| 2 |
Polyvinylpyrrolidones (PVPs): Switchable Leveler Additives for Damascene Applications Hai NTM, Furrer J, Stricker F, Huynh TMT, Gjuroski I, Luedi N, Brunner T, Weiss F, Fluegel A, Arnold M, Chang I, Mayer D, Broekmann P Journal of the Electrochemical Society, 160(12), D3116, 2013 |
| 3 |
Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM Huynh TMT, Hai NTM, Broekmann P Journal of the Electrochemical Society, 160(12), D3063, 2013 |
| 4 |
Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies Hai NTM, Huynh TMT, Fluegel A, Mayer D, Broekmann P Electrochimica Acta, 56(21), 7361, 2011 |