검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Modification of Epoxy-Resins with Polysiloxane Tpu for Electronic Encapsulation .2. Ho TH, Wang JH, Wang CS Journal of Applied Polymer Science, 60(8), 1097, 1996 |
| 2 |
Modification of Epoxy-Resins with Polysiloxane Thermoplastic Polyurethane for Electronic Encapsulation .1. Ho TH, Wang CS Polymer, 37(13), 2733, 1996 |
| 3 |
Low-Stress Encapsulants by Vinylsiloxane Modification Ho TH, Wang CS Journal of Applied Polymer Science, 51(12), 2047, 1994 |
| 4 |
Modification of Epoxy-Resins by Hydrosilation for Electronic Encapsulation Application Ho TH, Wang CS Journal of Applied Polymer Science, 54(1), 13, 1994 |