검색결과 : 17건
| No. | Article |
|---|---|
| 1 |
Probing the chemical interaction between different carbon allotropes oxides and titanium dioxide nanoparticles by Raman spectroscopy Corio P, Silva KC, Soares NA, Inoue F, Santos JJ Chemical Physics Letters, 723, 96, 2019 |
| 2 |
Influence of Si wafer thinning processes on (sub)surface defects Inoue F, Jourdain A, Peng L, Phommahaxay A, De Vos J, Rebibis KJ, Miller A, Sleeckx E, Beyne E, Uedono A Applied Surface Science, 404, 82, 2017 |
| 3 |
Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces Philipsen H, Jehoul H, Inoue F, Vandersmissen K, Yang L, Struyf H, van Dorp D Electrochimica Acta, 230, 407, 2017 |
| 4 |
Mitotic chromosome assembly despite nucleosome depletion in Xenopus egg extracts Shintomi K, Inoue F, Watanabe H, Ohsumi K, Ohsugi M, Hirano T Science, 356(6344), 1284, 2017 |
| 5 |
Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent Inoue F, Philipsen H, van der Veen MH, Van Huylenbroeck S, Armini S, Struyf H, Tanaka T Journal of the Electrochemical Society, 161(14), D768, 2014 |
| 6 |
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Leunissen P, Kondo M, Webb E, Shingubara S Electrochimica Acta, 100, 203, 2013 |
| 7 |
Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition Inoue F, Shimizu T, Miyake H, Arima R, Ito T, Seki H, Shinozaki Y, Yamamoto T, Shingubara S Electrochimica Acta, 82, 372, 2012 |
| 8 |
Electroless Copper Bath Stability Monitoring with UV-VIS Spectroscopy, pH, and Mixed Potential Measurements Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Shingubara S, Leunissen P Journal of the Electrochemical Society, 159(7), D437, 2012 |
| 9 |
Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology Inoue F, Shimizu T, Yokoyama T, Miyake H, Kondo K, Saito T, Hayashi T, Tanaka S, Terui T, Shingubara S Electrochimica Acta, 56(17), 6245, 2011 |
| 10 |
Perfect Conformal Deposition of Electroless Cu for High Aspect Ratio Through-Si Vias Inoue F, Harada Y, Koyanagi M, Fukushima T, Yamamoto K, Tanaka S, Wang Z, Shingubara S Electrochemical and Solid State Letters, 12(10), H381, 2009 |