화학공학소재연구정보센터
검색결과 : 16건
No. Article
1 Participation of cysteine 30 residue in the folding process of ovalbumin evaluated in a refolding experiment using cysteine mutants
Ishimaru T, Ito K, Tanaka M, Matsudomi N
Biochemical and Biophysical Research Communications, 495(1), 1061, 2018
2 Vacuum ultraviolet photoconductive detector based on pulse laser deposition-grown neodymium fluoride thin film
Ishimaru T, Ieda M, Ono S, Yokota Y, Yanagida T, Yoshikawa A
Thin Solid Films, 534, 12, 2013
3 Reconsideration of the Concept of Fluid Mixing
Okada B, Ishimaru T, Hashimoto S, Inoue Y
KAGAKU KOGAKU RONBUNSHU, 37(1), 4, 2011
4 Importance of N-glycosylation positioning for secretion and folding of ovalbumin
Ito K, Ishimaru T, Kimura F, Matsudomi N
Biochemical and Biophysical Research Communications, 361(3), 725, 2007
5 Depth profiling of fluorine-doped diamond-like carbon (F-DLC) film: Localized fluorine in the top-most thin layer can enhance the non-thrombogenic properties of F-DLC
Hasebe T, Nagashima S, Kamijo A, Yoshimura T, Ishimaru T, Yoshimoto Y, Yohena S, Kodama H, Hotta A, Takahashi K, Suzuki T
Thin Solid Films, 516(2-4), 299, 2007
6 Identification of NADH dehydrogenase 1 alpha subcomplex 5 capable to transforms murine fibroblasts and overexpressed in human cervical carcinoma cell lines
Shimada T, Moriuchi R, Mori T, Yamada K, Ishimaru T, Katamine S
Biochemical and Biophysical Research Communications, 339(3), 852, 2006
7 Lewis acid-catalyzed enantioselective hydroxylation reactions of oxindoles and beta-keto esters using DBFOX ligand
Ishimaru T, Shibata N, Nagai J, Nakamura S, Toru T, Kanemasa S
Journal of the American Chemical Society, 128(51), 16488, 2006
8 Copper barrier properties of low dielectric constant SiOCNH film deposited by plasma-enhanced CVD
Shioya Y, Ishimaru T, Ikakura H, Nishimoto Y, Ohdaira T, Suzuki R, Maeda K
Journal of the Electrochemical Society, 151(1), C56, 2004
9 The effects of dilution gas and pressure on the properties of PE-CVD low-k film
Shioya Y, Kotake Y, Ishimaru T, Masubuchi T, Ikakura H, Ohgawara S, Maeda K
Journal of the Electrochemical Society, 150(2), F1, 2003
10 Properties of low-k copper barrier SiOCH film deposited by PECVD using hexamethyldisiloxane and N2O
Ishimaru T, Shioya Y, Ikakura H, Nozawa M, Ohgawara S, Ohdaira T, Suzuki R, Maeda K
Journal of the Electrochemical Society, 150(5), F83, 2003