| 1 |
Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions
Vaskelis A, Jaciauskiene J, Stalnionien I, Norkus E
Journal of Electroanalytical Chemistry, 600(1), 6, 2007 |
| 2 |
Obtaining of high surface roughness copper deposits by electroless plating technique
Norkus E, Vaskelis A, Jaciauskiene J, Stalnioniene I, Stalnionis G
Electrochimica Acta, 51(17), 3495, 2006 |
| 3 |
Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands
Norkus E, Vaskelis A, Jaciauskiene J, Vaiciuniene J, Gaidamauskas E, Macalady DL
Journal of Applied Electrochemistry, 35(1), 41, 2005 |
| 4 |
Kinetics of electroless copper deposition using cobalt(II)-ethylenediamine complex compounds as reducing agents
Vaskelis A, Norkus E, Jaciauskiene J
Journal of Applied Electrochemistry, 32(3), 297, 2002 |
| 5 |
Copper hydride formation in the electroless copper plating process : in situ X-ray diffraction evidence and electrochemical study
Vaskelis A, Juskenas R, Jaciauskiene J
Electrochimica Acta, 43(9), 1061, 1998 |
| 6 |
Plasma surface modification of polyimide for improving adhesion to electroless copper coatings
Rozovskis G, Vinkevicius J, Jaciauskiene J
Journal of Adhesion Science and Technology, 10(5), 399, 1996 |
