검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
The influence of self-assembled disulfide additive on the pattern shape by Cu electrodeposition through mask Jenq SN, Wan CC, Wang YY Journal of Electroanalytical Chemistry, 609(2), 68, 2007 |
| 2 |
Tapered Cu pattern metallization by electrodeposition through mask Jenq SN, Wan CC, Wang YY, Li HW, Liu PT, Chen JH Electrochemical and Solid State Letters, 9(10), C167, 2006 |