검색결과 : 39건
| No. | Article |
|---|---|
| 1 |
Transient microscale flow boiling heat transfer characteristics of HFE-7000 Basu S, Werneke B, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 90, 396, 2015 |
| 2 |
Thermal behavior of a microdevice under transient heat loads Basu S, Werneke B, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 91, 1078, 2015 |
| 3 |
Flow condensation heat transfer enhancement in a mini-channel with hydrophobic and hydrophilic patterns Derby MM, Chatterjee A, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 68, 151, 2014 |
| 4 |
Effects of pin fin shape and configuration on the single-phase heat transfer characteristics of jet impingement on micro pin fins Ndao S, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 70, 856, 2014 |
| 5 |
Enhancement of condensation heat transfer with patterned surfaces Chatterjee A, Derby MM, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 71, 675, 2014 |
| 6 |
Model-based control of vapor compression cycles for transient heat-flux removal Pollock DT, Yang ZH, Wen JT, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 77, 662, 2014 |
| 7 |
Properties of plain weave metallic wire mesh screens Zhao ZH, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 57(2), 690, 2013 |
| 8 |
Water jet impingement boiling from structured-porous surfaces Zhao ZH, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 63, 445, 2013 |
| 9 |
Condensation heat transfer on patterned surfaces Chatterjee A, Derby MM, Peles Y, Jensen MK International Journal of Heat and Mass Transfer, 66, 889, 2013 |
| 10 |
Vapor compression refrigeration cycle for electronics cooling - Part I: Dynamic modeling and experimental validation Catano J, Zhang TJ, Wen JT, Jensen MK, Peles Y International Journal of Heat and Mass Transfer, 66, 911, 2013 |