검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy Jo JL, Lee JB, Kim JM, Shin YE, Jung SB Journal of Adhesion, 86(5-6), 470, 2010 |
| No. | Article |
|---|---|
| 1 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy Jo JL, Lee JB, Kim JM, Shin YE, Jung SB Journal of Adhesion, 86(5-6), 470, 2010 |