| 1 |
Development of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit board
Chu JH, Joo SJ, Kim HS
Thin Solid Films, 680, 1, 2019 |
| 2 |
Intense pulsed light sintering of Cu nano particles/micro particles-ink assisted with heating and vacuum holding of substrate for warpage free printed electronic circuit
Ryu CH, Joo SJ, Kim HS
Thin Solid Films, 675, 23, 2019 |
| 3 |
Flash light sintering of ag mesh films for printed transparent conducting electrode
Moon CJ, Kim I, Joo SJ, Chung WH, Lee TM, Kim HS
Thin Solid Films, 629, 60, 2017 |
| 4 |
Two-step flash light sintering of copper nanoparticle ink to remove substrate warping
Ryu CH, Joo SJ, Kim HS
Applied Surface Science, 384, 182, 2016 |
| 5 |
Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate
Jeon EB, Joo SJ, Ahn H, Kim HS
Thin Solid Films, 603, 382, 2016 |
| 6 |
Flavonoids from Machilus japonica Stems and Their Inhibitory Effects on LDL Oxidation
Joo SJ, Park HJ, Park JH, Cho JG, Kang JH, Jeong TS, Kang HC, Lee DY, Kim HS, Byun SY, Baek NI
International Journal of Molecular Sciences, 15(9), 16418, 2014 |
| 7 |
An Investigation into Methanol Oxidation Reactions and CO, OH Adsorption on Pt-Ru-Mo Catalysts for a Direct Methanol Fuel Cell
Park SH, Joo SJ, Kim HS
Journal of the Electrochemical Society, 161(4), F405, 2014 |
| 8 |
Investigation of SiO2 film growth on 4H-SiC by direct thermal oxidation and postoxidation annealing techniques in HNO3 & H2O vapor at varied process durations
Poobalan B, Moon JH, Kim SC, Joo SJ, Bahng W, Kang IH, Kim NK, Cheong KY
Thin Solid Films, 570, 138, 2014 |
| 9 |
Investigation of thermally grown oxide on 4H-SiC by a combination of H2O and HNO3 vapor with varied HNO3 solution heating temperature
Poobalan B, Moon JH, Kim SC, Joo SJ, Bahng W, Kang IH, Kim NK, Cheong KY
Applied Surface Science, 285, 795, 2013 |
| 10 |
Black SiC formation induced by Si overlayer deposition and subsequent plasma etching
Joo SJ, Kang MS, Bahng W, Koo SM
Thin Solid Films, 519(11), 3728, 2011 |
