검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
The Processing Windows for Selective Copper Chemical-Vapor-Deposition from Cu(Hexafluoroacetylacetonate)Trimethylvinylsilane Chiou JC, Juang KC, Chen MC Journal of the Electrochemical Society, 142(1), 177, 1995 |
| 2 |
TiW(N) as Diffusion-Barriers Between Cu and Si Chiou JC, Juang KC, Chen MC Journal of the Electrochemical Society, 142(7), 2326, 1995 |