1 |
Improvement of trench MOS barrier Schottky rectifier by using high-energy counter-doping trench-bottom implantation Juang MH, Yu J, Jang SL Current Applied Physics, 11(3), 698, 2011 |
2 |
Formation of polycrystalline thin-film transistors with stacked poly-SiGe/poly-Si channel layer for low-voltage applications Juang MH, Chang CW, Peng YS, Hwang CC, Wang JL, Shye DC Thin Solid Films, 519(10), 3393, 2011 |
3 |
Formation of microcrystalline-Si thin film transistors by using self-aligned nickel-silicided process Juang MH, Peng YS, Liu BJ Thin Solid Films, 519(11), 3902, 2011 |
4 |
Study of ultra-shallow p(+)n junctions formed by excimer laser annealing Juang MH, Lu CN, Jang SL, Cheng HC Materials Chemistry and Physics, 123(1), 260, 2010 |
5 |
Formation of sub-micrometer polycrystalline-SiGe thin-film transistors by using a thinned channel layer Juang MH, Chang CW, Huang CW, Wang JL, Shye DC, Hwang CC, Jang SL Solid-State Electronics, 54(3), 303, 2010 |
6 |
Formation of n-channel polycrystalline-Si thin-film transistors by dual source/drain implantation Juang MH, Chang CW, Wang JL, Shye DC, Hwang CC, Jang SL Solid-State Electronics, 54(5), 516, 2010 |
7 |
Formation of 30-V power DMOSFET's by implementing p-counter-doped region within n-type drift layer Juang MH, Hwang CC, Shye DC, Wang JL, Jang SL Solid-State Electronics, 54(7), 724, 2010 |
8 |
Microcrystalline-Si thin-film transistors formed by using palladium silicided source/drain contact electrode Juang MH, Peng YS, Wang JL, Shye DC, Hwang CC, Jang SL Solid-State Electronics, 54(12), 1532, 2010 |
9 |
Submicron-meter polycrystalline-SiGe thin-film transistors with tunneling field-effect-transistor structure Juang MH, Peng YS, Wang JL, Shye DC, Hwang CC, Jang SL Solid-State Electronics, 54(12), 1686, 2010 |
10 |
Formation of polycrystalline-Si thin-film transistors with tunneling field-effect-transistor structure Juang MH, Hu PS, Jang SL Thin Solid Films, 518(14), 3978, 2010 |