검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
The use of unsaturated fluorocarbons for dielectric etch applications Chatterjee R, Karecki S, Reif R, Vartanian V, Sparks T Journal of the Electrochemical Society, 149(4), G276, 2002 |
| 2 |
Evaluation of oxalyl fluoride for a dielectric etch application in an inductively coupled plasma etch tool Karecki S, Chatterjee R, Pruette L, Reif R, Sparks T, Beu L, Vartanian V, Novoselov M Journal of the Electrochemical Society, 148(3), G141, 2001 |
| 3 |
The evaluation of hexafluorobenzene as an environmentally benign dielectric etch chemistry Chatterjee R, Karecki S, Reif R, Sparks T, Vartanian V, Goolsby B Journal of the Electrochemical Society, 148(12), G721, 2001 |
| 4 |
Characterization of iodoheptafluoropropane as a dielectric etchant. I. Process performance evaluation Karecki S, Chatterjee R, Pruette L, Reif R, Vartanian V, Sparks T, Beu L, Novoselov K Journal of Vacuum Science & Technology B, 19(4), 1269, 2001 |
| 5 |
Characterization of iodoheptafluoropropane as a dielectric etchant. II. Wafer surface analysis Karecki S, Chatterjee R, Pruette L, Reif R, Vartanian V, Sparks T, Lee JJ, Beu L, Miller C Journal of Vacuum Science & Technology B, 19(4), 1293, 2001 |
| 6 |
Characterization of iodoheptafluoropropane as a dielectric etchant. III. Effluent analysis Karecki S, Chatterjee R, Pruette L, Reif R, Vartanian V, Sparks T, Beu L Journal of Vacuum Science & Technology B, 19(4), 1306, 2001 |
| 7 |
Evaluation of C4F8O as an alternative plasma-enhanced chemical vapor deposition chamber clean chemistry Pruette L, Karecki S, Reif R, Tousignant L, Reagan W, Kesari S, Zazzera L Journal of the Electrochemical Society, 147(3), 1149, 2000 |
| 8 |
High density plasma oxide etching using nitrogen trifluoride and acetylene Pruette L, Karecki S, Chatterjee R, Reif R, Sparks T, Vartanian V Journal of Vacuum Science & Technology A, 18(6), 2749, 2000 |
| 9 |
Use of novel hydrofluorocarbon and iodofluorocarbon chemistries for a high aspect ratio via etch in a high density plasma etch tool Karecki S, Pruette L, Reif R Journal of the Electrochemical Society, 145(12), 4305, 1998 |
| 10 |
Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool Karecki S, Pruette L, Reif R, Beu L, Sparks T, Vartanian V Journal of Vacuum Science & Technology A, 16(4), 2722, 1998 |