1 |
Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate Sharma G, Chong SC, Ebin L, Hui C, Gan CL, Kripesh V Thin Solid Films, 515(7-8), 3315, 2007 |
2 |
Misalignment of the optical fibers in multi-channel V-grooves Priyadarshi A, Fen LH, Asundi AK, Mhaisalkar SG, Ramana PV, Kripesh V Thin Solid Films, 504(1-2), 341, 2006 |
3 |
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications Kumar KM, Kripesh V, Shen L, Tay AAO Thin Solid Films, 504(1-2), 371, 2006 |
4 |
Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate Kumar A, Chen Z, Mhaisalkar SG, Wong CC, Teo PS, Kripesh V Thin Solid Films, 504(1-2), 410, 2006 |
5 |
Characterization of optical properties of acrylate based adhesives exposed to different temperature conditions Priyadarshi A, Shimin L, Mhaisalkar SG, Rajoo R, Wong EH, Kripesh V, Namdas EB Journal of Applied Polymer Science, 98(3), 950, 2005 |