검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Wafer scale packaging of MEMS by using plasma-activated wafer bonding Suni T, Henttinen K, Lipsanen A, Dekker J, Luoto H, Kulawski M Journal of the Electrochemical Society, 153(1), G78, 2006 |
| 2 |
Silicon-on-insulator wafers with buried cavities Suni T, Henttinen K, Dekker J, Luoto H, Kulawski M, Makinen J, Mutikainen R Journal of the Electrochemical Society, 153(4), G299, 2006 |
| 3 |
Direct bonding of thick film polysilicon to glass substrates Luoto H, Suni T, Henttinen K, Kulawski M Journal of the Electrochemical Society, 153(11), G981, 2006 |