검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Synergistic Toughening of Epoxy-Copper Interface Using a Thiol-Based Coupling Layer Wong CKY, Leung SYY, Fan HB, Yuen MMF Journal of Adhesion Science and Technology, 25(16), 2081, 2011 |
| 2 |
The role of water in delamination in electronic packages: degradation of interfacial adhesion Leung SYY, Lam DCC, Luo SJ, Wong CP Journal of Adhesion Science and Technology, 18(10), 1103, 2004 |