검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Leunissen P, Kondo M, Webb E, Shingubara S Electrochimica Acta, 100, 203, 2013 |
| 2 |
Electroless Copper Bath Stability Monitoring with UV-VIS Spectroscopy, pH, and Mixed Potential Measurements Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Shingubara S, Leunissen P Journal of the Electrochemical Society, 159(7), D437, 2012 |
| 3 |
Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents Barbagini F, Halder S, Janssens T, Kenis K, Wostyn K, Bearda T, Quoc TL, Leunissen P, Mertens P, Kim KH, Andreas M Journal of Adhesion Science and Technology, 23(12), 1709, 2009 |