| 1 |
The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)
Jin SH, Yoon Y, Jo YG, Lee SY, Moon HS, Seok SH, Kim MJ, Kim JJ, Lee MH
Journal of Industrial and Engineering Chemistry, 96, 376, 2021 |
| 2 |
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating
Lai ZQ, Wang SX, Wang C, Hong Y, Chen YM, Zhang HW, Zhou GY, He W, Ai KH, Peng YQ
Electrochimica Acta, 273, 318, 2018 |
| 3 |
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole
Zheng L, He W, Zhu K, Wang C, Wang SX, Hong Y, Chen YM, Zhou GY, Miao H, Zhou JQ
Electrochimica Acta, 283, 560, 2018 |
| 4 |
The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
Liao CH, Zhang ST, Chen SJ, Qiang YJ, Liu G, Tang MX, Tan BC, Fu DL, Xu Y
Journal of Electroanalytical Chemistry, 827, 151, 2018 |
| 5 |
Effects of Cyclohexane- Monoxime and Dioxime on the Electrodeposition of Cobalt
Lyons TW, Huang Q
Electrochimica Acta, 245, 301, 2017 |
| 6 |
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums
Kim MJ, Seo Y, Kim HC, Lee Y, Choe S, Kim YG, Cho SK, Kim JJ
Electrochimica Acta, 163, 174, 2015 |
| 7 |
Effects of functional groups of triple bonds containing molecules on nickel electroplating
Sezer E, Ustamehmetoglu B, Katirch R
Turkish Journal of Chemistry, 38(5), 701, 2014 |
| 8 |
Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison
Wang C, Zhang JQ, Yang PX, An MZ
Electrochimica Acta, 92, 356, 2013 |
| 9 |
Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath
Wang AY, Chen B, Fang L, Yu JJ, Wang LM
Electrochimica Acta, 108, 698, 2013 |
| 10 |
Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Luhn O, Van Hoof C, Ruythooren W, Celis JP
Electrochimica Acta, 54(9), 2504, 2009 |
