화학공학소재연구정보센터
검색결과 : 5건
No. Article
1 WC/C:H films synthesized by an hybrid reactive magnetron sputtering/Plasma Enhanced Chemical Vapor Deposition process: An alternative to Cr (VI) based hard chromium plating
Nouvellon C, Belchi R, Libralesso L, Douheret O, Lazzaroni R, Snyders R, Thiry D
Thin Solid Films, 630, 79, 2017
2 Fracture toughness measurement of ultra-thin hard films deposited on a polymer interlayer
Favache A, Libralesso L, Jacques PJ, Raskin JP, Bailly C, Nysten B, Pardoen T
Thin Solid Films, 550, 464, 2014
3 H2O Diffusion Barriers at Si-Si Direct Bonding Interfaces for Low Temperature Anneals
Moriceau H, Rieutord F, Libralesso L, Ventosa C, Fournel F, Morales C, Mc Cormick T, Chevolleau T, Radu I
Journal of the Electrochemical Society, 158(9), H919, 2011
4 Mechanism of Thermal Silicon Oxide Direct Wafer Bonding
Ventosa C, Morales C, Libralesso L, Fournel F, Papon AM, Lafond D, Moriceau H, Penot JD, Rieutord F
Electrochemical and Solid State Letters, 12(10), H373, 2009
5 Prebonding Thermal Treatment in Direct Si-Si Hydrophilic Wafer Bonding
Ventosa C, Rieutord F, Libralesso L, Fournel F, Morales C, Moriceau H
Journal of the Electrochemical Society, 156(11), H818, 2009