검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Copper Electroplating with Polyethylene Glycol: Part II. Experimental Analysis and Determination of Model Parameters Yang H, Krause R, Scheunert C, Liske R, Uhlig B, Preusse A, Dianat A, Bobeth M, Cuniberti G Journal of the Electrochemical Society, 165(2), D13, 2018 |
| 2 |
The Influence of Adsorption Kinetics on Copper Superfilling for Dual Damascene Liske R, Krause R, Uhlig B, Gerlich L, Bott S, Wislicenus M, Preusse A Journal of the Electrochemical Society, 163(6), D213, 2016 |
| 3 |
Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties Wojcik H, Junige M, Bartha W, Albert M, Neumann V, Merkel U, Peeva A, Gluch J, Menzel S, Munnik F, Liske R, Utess D, Richter I, Klein C, Engelmann HJ, Ho P, Hossbach C, Wenzel C Journal of the Electrochemical Society, 159(2), H166, 2012 |
| 4 |
Influence of Additive Coadsorption on Copper Superfill Behavior Liske R, Wehner S, Preusse A, Kuecher P, Bartha JW Journal of the Electrochemical Society, 156(12), H955, 2009 |