화학공학소재연구정보센터
검색결과 : 7건
No. Article
1 Chemical-mechanical polishing of SiOC organosilicate glasses: the effect of film carbon content
Borst CL, Korthuis V, Shinn GB, Luttmer JD, Gutmann RJ, Gill WN
Thin Solid Films, 385(1-2), 281, 2001
2 A new process for depositing tungsten nitride thin films
Lu JP, Hsu WY, Luttmer JD, Magel LK, Tsai HL
Journal of the Electrochemical Society, 145(2), L21, 1998
3 Thermal stability of Al/barrier/TiSix multilayer structures
Lu JP, Hsu WY, Hong QZ, Dixit GA, Luttmer JD, Havemann RH, Chen PJ, Tsai HL, Magel LK
Thin Solid Films, 320(1), 20, 1998
4 Integrated CVD-PVD Al plug processing for sub-half micron features
Konecni A, Dixit G, Russell NM, Luttmer JD, Havemann RH
Thin Solid Films, 320(1), 52, 1998
5 Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization
Chen YP, Dixit GA, Lu JP, Hsu WY, Konecni AJ, Luttmer JD, Havemann RH
Thin Solid Films, 320(1), 73, 1998
6 Effect of Ar Sputter Etch on the Texture of Ti and Al/Tin/Ti Metal Stack
Hsu WY, Hong QZ, Liu HY, Douglas M, Taylor K, Magel LK, Luttmer JD, Havemann RH
Journal of the Electrochemical Society, 144(9), L248, 1997
7 A Novel Process for Fabricating Conformal and Stable Tin-Based Barrier
Lu JP, Hsu WY, Hong QZ, Dixit GA, Luttmer JD, Havemann RH, Magel LK
Journal of the Electrochemical Society, 143(12), L279, 1996