| 1 |
Polyimide incorporated cyanate ester/epoxy copolymers for high-temperature molding compounds
Wu F, Song B, Hah J, Tuan CC, Moon KS, Wong CP
Journal of Polymer Science Part A: Polymer Chemistry, 56(21), 2412, 2018 |
| 2 |
Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices
Scandurra A, Zafarana R, Tenya Y, Pignataro S
Applied Surface Science, 235(1-2), 65, 2004 |
| 3 |
Study of heat of reaction between plasma-polymer-coated silica fillers and biphenyl epoxy resin
Kim NI, Kang HM, Yoon TH
Journal of Adhesion Science and Technology, 18(12), 1325, 2004 |
| 4 |
EMC characterization and process study for electronics packaging
Liu SL, Chen G, Yong MS
Thin Solid Films, 462-63, 454, 2004 |
| 5 |
DSC analysis of epoxy molding compound with plasma polymer-coated silica fillers
Roh JH, Lee JH, Kim NI, Kang HM, Yoon TH, Song KH
Journal of Applied Polymer Science, 90(9), 2508, 2003 |
| 6 |
Study of adhesion failure due to molding compound additives at chip surface in electronic devices
Scandurra A, Zafarana R, Tenya Y, Pignataro S
Journal of Adhesion Science and Technology, 15(9), 1039, 2001 |
| 7 |
Multiplexing frequency mode study of packaging epoxy molding compounds using dynamic mechanical analysis
Tsang CF, Hui HK
Thermochimica Acta, 367-368, 93, 2001 |
| 8 |
Epoxy Molding Compound의 경화거동에 관한 연구
윤상영, 오명숙, 박내정
Polymer(Korea), 24(6), 837, 2000 |
| 9 |
Synthesis of aralkyl novolac epoxy resins and their modification with polysiloxane thermoplastic polyurethane for semiconductor encapsulation
Ho TH, Wang CS
Journal of Applied Polymer Science, 74(8), 1905, 1999 |
| 10 |
Modification of Epoxy-Resins with Polysiloxane Tpu for Electronic Encapsulation .2.
Ho TH, Wang JH, Wang CS
Journal of Applied Polymer Science, 60(8), 1097, 1996 |
