검색결과 : 1건
No. | Article |
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1 |
Mechanism of via failure in copper/organosilicate glass interconnects induced by oxidation Min WS, Kim DJ, Pyo SG, Park SJ, Choi JT, Kim S Thin Solid Films, 515(7-8), 3875, 2007 |
No. | Article |
---|---|
1 |
Mechanism of via failure in copper/organosilicate glass interconnects induced by oxidation Min WS, Kim DJ, Pyo SG, Park SJ, Choi JT, Kim S Thin Solid Films, 515(7-8), 3875, 2007 |