화학공학소재연구정보센터
검색결과 : 16건
No. Article
1 Moisture-induced material instability of porous organosilicate glass
Chang TC, Chen CW, Liu PT, Mor YS, Tsai HM, Tsai TM, Yan ST, Tu CH, Tseng TY, Sze SM
Electrochemical and Solid State Letters, 6(4), F13, 2003
2 Direct Patterning of low-k hydrogen silsesquioxane using X-ray exposure technology
Chang TC, Tsai TM, Liu PT, Mor YS, Chen CW, Sheu JT, Tsengb TY
Electrochemical and Solid State Letters, 6(5), G69, 2003
3 Direct Patterning of low-k hydrogen silsesquioxane using X-ray exposure technology (vol 6, pg G69, 2003)
Chang TC, Tsai TM, Liu PT, Mor YS, Chen CW, Sheu JT, Tseng TY
Electrochemical and Solid State Letters, 6(7), L3, 2003
4 Effective strategy for porous organosilicate to suppress oxygen ashing damage
Liu PT, Chang TC, Mor YS, Chen CW, Tsai TM, Chu CJ, Pan FM, Sze SM
Electrochemical and Solid State Letters, 5(3), G11, 2002
5 Recovering dielectric loss of low dielectric constant organic siloxane during the photoresist removal process
Chang TC, Mor YS, Liu PT, Tsai TM, Chen CW, Mei YJ, Sze SM
Journal of the Electrochemical Society, 149(8), F81, 2002
6 Trimethylchlorosilane treatment of ultralow dielectric constant material after photoresist removal processing
Chang TC, Mor YS, Liu PT, Tsai TM, Chen CW, Chu CJ, Pan FM, Lur W, Sze SM
Journal of the Electrochemical Society, 149(10), F145, 2002
7 Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatment
Mor YS, Chang TC, Liu PT, Tsai TM, Chen CW, Yan ST, Chu CJ, Wu WF, Pan FM, Lur W, Sze SM
Journal of Vacuum Science & Technology B, 20(4), 1334, 2002
8 Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
Chang TC, Liu PT, Mor YS, Tsai TM, Chen CW, Mei YJ, Pan FM, Wu WF, Sze SM
Journal of Vacuum Science & Technology B, 20(4), 1561, 2002
9 The novel pattern method of low-k hybrid-organic-siloxane-polymer film using X-ray exposure
Chang TC, Tsai TM, Liu PT, Mor YS, Chen CW, Mei YJ, Sheu JT, Tseng TY
Thin Solid Films, 420-421, 403, 2002
10 Improvement in integration issues for organic low-k hybrid-organic-siloxane-polymer
Liu PT, Chang TC, Su H, Mor YS, Yang YL, Chung H, Hou J, Sze SM
Journal of the Electrochemical Society, 148(2), F30, 2001