검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests Shin DK, Im J Thin Solid Films, 531, 340, 2013 |
| No. | Article |
|---|---|
| 1 |
Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests Shin DK, Im J Thin Solid Films, 531, 340, 2013 |