검색결과 : 32건
No. | Article |
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1 |
Stability of Cu on epoxy siloxane polymer under bias temperature stress Wang PI, Juneja JS, Murarka SP, Lu TM, Jezewski C, Ghoshal R, Ghoshal R, Bakhru H Journal of the Electrochemical Society, 153(4), G358, 2006 |
2 |
Mobile ion detection in organosiloxane polymer using triangular voltage sweep Mallikarjunan A, Murarka SP, Lu TM Journal of the Electrochemical Society, 149(10), F155, 2002 |
3 |
Plasma surface modification for ion penetration barrier in organosiloxane polymer Mallikarjunan A, Yang GR, Murarka SP, Lu TM Journal of Vacuum Science & Technology B, 20(5), 1884, 2002 |
4 |
Evolution of the Cu-Al alloy/SiO2 interfaces during bias temperature stressing Wang PI, Murarka SP, Yang GR, Lu TM Journal of the Electrochemical Society, 148(2), G78, 2001 |
5 |
Surface segregation of Al of the bilayers of pure Cu and Cu-Al alloy films Wang PI, Murarka SP, Kaminski DA, Bedell S, Lanford WA Journal of the Electrochemical Society, 148(9), G481, 2001 |
6 |
Thickness dependent electrical resistivity of ultrathin (< 40 nm) Cu films Liu HD, Zhao YP, Ramanath G, Murarka SP, Wang GC Thin Solid Films, 384(1), 151, 2001 |
7 |
Resistivity of copper films at thicknesses near the mean free path of electrons in copper - Minimization of the diffuse scattering in copper Mallikarjunan A, Sharma S, Murarka SP Electrochemical and Solid State Letters, 3(9), 437, 2000 |
8 |
Electrical behavior of Cu thin fluorinated PECVD oxide MIS capacitors Mallikarjunan A, Murarka SP, Steinbruchel C, Kumar A, Bakhru H Journal of the Electrochemical Society, 147(9), 3502, 2000 |
9 |
Chemical mechanical polishing of low dielectric constant oxide films deposited using flowfill chemical vapor deposition technology Cui H, Bhat IB, Murarka SP, Lu HQ, Li WD, Hsia WJ, Catabay W Journal of the Electrochemical Society, 147(10), 3816, 2000 |
10 |
Investigation of aluminum-indium alloys for interconnect applications Kailasam SK, Murarka SP, Glicksman ME Journal of the Electrochemical Society, 147(11), 4318, 2000 |