| 1 |
Low-temperature sol-gel intermediate layer wafer bonding
Deng SS, Tan CM, Wei J, Yu W, Nai SML, Xie H
Thin Solid Films, 496(2), 560, 2006 |
| 2 |
Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites
Nai SML, Wei J, Gupta M
Thin Solid Films, 504(1-2), 401, 2006 |
| 3 |
Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging
Shi XQ, Kwan HF, Nai SML, Lim GH
Journal of Materials Science, 39(3), 1095, 2004 |
| 4 |
Glass-to-glass anodic bonding process and electrostatic force
Wei J, Nai SML, Wong CK, Lee LC
Thin Solid Films, 462-63, 487, 2004 |
| 5 |
Synthesis and characterization of free standing, bulk Al/SiCp functionally gradient materials: effects of different stirrer geometries
Nai SML, Gupta M
Materials Research Bulletin, 38(11-12), 1573, 2003 |
| 6 |
Synthesis of Al/TiCp based functionally gradient materials using the novel technique of gradient slurry disintegration and deposition: Effect of particulates feed rate
Nai SML, Gupta M
Materials Science Forum, 437-4, 157, 2003 |
