검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Copper/benzocyclobutene interconnects for sub-100 nm integrated circuit technology: Elimination of high-resistivity metallic liners and high-dielectric constant polish stops Neirynck JM, Gutmann RJ, Murarka SP Journal of the Electrochemical Society, 146(4), 1602, 1999 |
| 2 |
Chemical-Mechanical Polishing of Parylene-N and Benzocyclobutene Films Yang GR, Zhao YP, Neirynck JM, Murarka SP, Gutmann RJ Journal of the Electrochemical Society, 144(9), 3249, 1997 |
| 3 |
The Addition of Surfactant to Slurry for Polymer CMP - Effects on Polymer Surface, Removal Rate and Underlying Cu Neirynck JM, Yang GR, Murarka SP, Gutmann RJ Thin Solid Films, 290-291, 447, 1996 |