검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
The Impact of Organic Additives on Copper Trench Microstructure Marro JB, Okoro CA, Obeng YS, Richardson KC Journal of the Electrochemical Society, 164(9), D543, 2017 |
| 2 |
The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films Marro JB, Darroudi T, Okoro CA, Obeng YS, Richardson KC Thin Solid Films, 621, 91, 2017 |
| 3 |
A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics Okoro CA, Obeng YS Thin Solid Films, 520(15), 5060, 2012 |
| 4 |
Surface-modified polymeric pads for enhanced performance during chemical mechanical planarization Deshpande S, Dakshinamurthy S, Kuiry SC, Vaidyanathan R, Obeng YS, Seal S Thin Solid Films, 483(1-2), 261, 2005 |
| 5 |
Processing and characterization of ultralow-dielectric constant organosilicate Yang S, Pai JCH, Pai CS, Dabbagh G, Nalamasu O, Reichmanis E, Seputro J, Obeng YS Journal of Vacuum Science & Technology B, 19(6), 2155, 2001 |
| 6 |
Impact of post via-etch cleans on mechanical reliability of W-plug vias Obeng YS, Kang SH, Huang JS, Oates AS, Lin X, Obeng JS Thin Solid Films, 391(1), 149, 2001 |
| 7 |
Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection Huang JS, Deng XJ, Yih PH, Shofner TL, Obeng YS, Darling C Thin Solid Films, 397(1-2), 186, 2001 |
| 8 |
Asymmetrical critical current density and its influence on electromigration of two-level W-plug interconnection Huang JS, Oates AS, Obeng YS, Brown WL Journal of the Electrochemical Society, 147(10), 3840, 2000 |
| 9 |
Pitting of the Silicon Layer of Poly Buffered Locos Stack Obeng YS, Brady DC, Vitkavage SC, Taylor JA, Hanson KJ, Sapjeta BJ Journal of the Electrochemical Society, 142(5), 1680, 1995 |