검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Comparison of various low dielectric constant materials Cheng YL, Lee CY, Hung WJ, Chen GS, Fang JS Thin Solid Films, 660, 871, 2018 |
| 2 |
Structural characterization of amorphous materials applied to low-k organosilicate materials Raymunt AC, Clancy P Thin Solid Films, 562, 411, 2014 |
| 3 |
The comparative study of thermal stability among silicon dioxide, fluorinated silicate glass, hydrogen silsesquioxane, and organosilicate glass dielectrics on silicon Jeng JS, Chen JS Thin Solid Films, 516(18), 6013, 2008 |
| 4 |
Mechanism of via failure in copper/organosilicate glass interconnects induced by oxidation Min WS, Kim DJ, Pyo SG, Park SJ, Choi JT, Kim S Thin Solid Films, 515(7-8), 3875, 2007 |
| 5 |
Chemical-mechanical polishing of SiOC organosilicate glasses: the effect of film carbon content Borst CL, Korthuis V, Shinn GB, Luttmer JD, Gutmann RJ, Gill WN Thin Solid Films, 385(1-2), 281, 2001 |