| 1 |
Production of turmeric extract-loaded nanoemulsions at the laboratory-scale and pilot-scale: Comparison of processing conditions and properties
Lee SB, Garcia CV, Hong SJ, Shin GH, Kim JT
Journal of Food Engineering, 261, 125, 2019 |
| 2 |
The Study on the Stress and Photo-Oxidative Aging of Polyethylene Cable Sheath Under Different Processing Conditions
Hu W, Liu C, Liu W, Ren X
Macromolecular Research, 26(5), 426, 2018 |
| 3 |
Dissolution of Semicrystalline Polymer Fibers: Numerical Modeling and Parametric Analysis
Ghasemi M, Singapati AY, Tsianou M, Alexandridis P
AIChE Journal, 63(4), 1368, 2017 |
| 4 |
The effect of processing conditions on performance of small-molecule organic solar cells
Zhang H, Wang CX, Li X, Jing JL, Sun YY, Liu YQ
Solar Energy, 157, 71, 2017 |
| 5 |
Upscaling from benchtop processing to industrial scale production: More factors to be considered for pulsed electric field food processing
Jin TZ, Guo MM, Zhang HQ
Journal of Food Engineering, 146, 72, 2015 |
| 6 |
Effect of silicon solar cell processing parameters and crystallinity on mechanical strength
Popovich VA, Yunus A, Janssen M, Richardson IM, Bennett IJ
Solar Energy Materials and Solar Cells, 95(1), 97, 2011 |
| 7 |
Influence of Processing Conditions and Physicochemical Interactions on Morphology and Fracture Behavior of a Clay/Thermoplastic/Thermosetting Ternary Blend
Hernandez M, Duchet-Rumeau J, Sautereau H
Journal of Applied Polymer Science, 118(6), 3632, 2010 |
| 8 |
Mechanical Properties of Polypropylene/Clay Nanocomposites: Effect of Clay Content, Polymer/Clay Compatibility, and Processing Conditions
Tarapow JA, Bernal CR, Alvarez VA
Journal of Applied Polymer Science, 111(2), 768, 2009 |
| 9 |
Rheological Analysis of the Degradation of HDPE During Consecutive Processing Steps and for Different Processing Conditions
Kealy T
Journal of Applied Polymer Science, 112(2), 639, 2009 |
| 10 |
Effect of Processing Conditions on Adhesion Performance of a Sol-Gel Reinforced Epoxy/Aluminum Interface
Liu J, Chaudhury MK, Berry DH, Seebergh JE, Osborne JH, Blohowiak KY
Journal of Adhesion Science and Technology, 22(10-11), 1159, 2008 |
