검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Oxalic-acid-based slurries with tunable selectivity for copper and tantalum removal in CMP Janjam SVSB, Surisetty CVVS, Pandija S, Roy D, Babu SV Electrochemical and Solid State Letters, 11(3), H66, 2008 |
| 2 |
Investigation of dissolution inhibitors for electrochemical mechanical planarization of copper using beta-alanine as a complexing agent Klug BK, Pettit CM, Pandija S, Babu SV, Roy D Journal of Applied Electrochemistry, 38(10), 1347, 2008 |
| 3 |
Chemical mechanical planarization of copper using abrasive-free solutions of oxalic acid and hydrogen peroxide Pandija S, Roy D, Babu SV Materials Chemistry and Physics, 102(2-3), 144, 2007 |
| 4 |
Oxalic acid as a complexing agent in CMP slurries for copper Gorantla VRK, Babel A, Pandija S, Babua SV Electrochemical and Solid State Letters, 8(5), G131, 2005 |