검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Ultralow k films by using a plasma-enhanced chemical vapor deposition porogen approach: Study of the precursor reaction mechanisms Castex A, Jousseaume V, Deval J, Bruat J, Favennec L, Passemard G Journal of Vacuum Science & Technology A, 26(5), 1343, 2008 |
| 2 |
Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials Zenasnia A, Remiat B, Waldfiied C, Le Cornec C, Jousseaume V, Passemard G Thin Solid Films, 516(6), 1097, 2008 |
| 3 |
Investigation of porogen behavior during the curing process of ultralow-k spin-on materials - Chemical transformation-kinetics Zenasni A, Ciaramella F, Jousseaume V, Le Cornec C, Passemard G Journal of the Electrochemical Society, 154(1), G6, 2007 |
| 4 |
Crosslinking impact of mesoporous MSQ films used in microelectronic interconnections on mechanical properties Ciaramella F, Jousseaume V, Maitrejean S, Verdier M, Remiat B, Zenasni A, Passemard G Thin Solid Films, 495(1-2), 124, 2006 |
| 5 |
Pore sealing of a porous dielectric by using a thin PECVD a-SiC : H conformal liner Jousseaume V, Fayolle M, Guedj C, Haumesser PH, Huguet C, Pierre F, Pantel R, Feldis H, Passemard G Journal of the Electrochemical Society, 152(10), F156, 2005 |