| 1 |
Effect of Temperature on the Corrosion Inhibition of Nonionic Surfactant TRITON-X-405 on Ferritic Stainless Steel in 1.0 M H2SO4
Godec RF, Pavlovic MG, Tomic MV
Industrial & Engineering Chemistry Research, 51(1), 274, 2012 |
| 2 |
Correlate between morphology of powder particles obtained by the different regimes of electrolysis and the quantity of evolved hydrogen
Nikolic ND, Brankovic G, Pavlovic MG
Powder Technology, 221, 271, 2012 |
| 3 |
Characterization of copper powder particles obtained by electrodeposition as function of different current densities
Maksimovic VM, Pavlovic LJ, Pavlovic MG, Tomic MV
Journal of Applied Electrochemistry, 39(12), 2545, 2009 |
| 4 |
Influence of potential pulse conditions on the formation of honeycomb-like copper electrodes
Nikolic ND, Brankovic G, Maksimovic VM, Pavlovic MG, Popov KI
Journal of Electroanalytical Chemistry, 635(2), 111, 2009 |
| 5 |
Influence of ionic equilibrium in the CuSO4-H2SO4-H2O system on the formation of irregular electrodeposits of copper
Nikolic ND, Pavlovic LJ, Krstic SB, Pavlovic MG, Popov KI
Chemical Engineering Science, 63(10), 2824, 2008 |
| 6 |
Characterization of electrodeposited powders of the system Ni-Mo-O
Jovic BM, Jovic VD, Maksimovic VM, Pavlovic MG
Electrochimica Acta, 53(14), 4796, 2008 |
| 7 |
The effect of hydrogen co-deposition on the morphology of copper electrodeposits. II. Correlation between the properties of electrolytic solutions and the quantity of evolved hydrogen
Nikolic ND, Brankovic G, Pavlovic MG, Popov KI
Journal of Electroanalytical Chemistry, 621(1), 13, 2008 |
| 8 |
Morphologies of electrochemically formed copper powder particles and their dependence on the quantity of evolved hydrogen
Nikolic ND, Pavlovic LJ, Pavlovic MG, Popov KI
Powder Technology, 185(3), 195, 2008 |
| 9 |
Electrodeposition and morphology of Ni, Co and Ni-Co alloy powders -Part II. Ammonium chloride supporting electrolyte
Jovic VD, Jovic BM, Maksimovic V, Pavlovic MG
Electrochimica Acta, 52(12), 4254, 2007 |
| 10 |
Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition
Nikolic ND, Pavjovic LJ, Pavlovic MG, Popova KI
Electrochimica Acta, 52(28), 8096, 2007 |
