| 1 |
Use of anionic surfactants for selective polishing of silicon dioxide over silicon nitride films using colloidal silica-based slurries
Penta NK, Amanapu HP, Peethala BC, Babu SV
Applied Surface Science, 283, 986, 2013 |
| 2 |
Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries
Peethala BC, Amanapu HP, Lagudu URK, Babu SV
Journal of the Electrochemical Society, 159(6), H582, 2012 |
| 3 |
Controlling the Galvanic Corrosion of Copper during Chemical Mechanical Planarization of Ruthenium Barrier Films
Peethala BC, Roy D, Babu SV
Electrochemical and Solid State Letters, 14(7), H306, 2011 |
| 4 |
Ruthenium Polishing Using Potassium Periodate as the Oxidizer and Silica Abrasives
Peethala BC, Babu SV
Journal of the Electrochemical Society, 158(3), H271, 2011 |
| 5 |
Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions
Dandu PRV, Peethala BC, Amanapu HP, Babu SV
Journal of the Electrochemical Society, 158(8), H763, 2011 |
| 6 |
Chemical Mechanical Planarization of TaN Wafers Using Oxalic and Tartaric Acid Based Slurries
Janjam SVSB, Peethala BC, Roy D, Babu SV
Electrochemical and Solid State Letters, 13(1), II1, 2010 |
| 7 |
Utility of Oxy-Anions for Selective Low Pressure Polishing of Cu and Ta in Chemical Mechanical Planarization
Surisetty CVVS, Peethala BC, Roy D, Babu SV
Electrochemical and Solid State Letters, 13(7), H244, 2010 |
| 8 |
Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films
Dandu PRV, Penta NK, Peethala BC, Babu SV
Journal of Colloid and Interface Science, 348(1), 114, 2010 |
| 9 |
Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions
Dandu PRV, Peethala BC, Babu SV
Journal of the Electrochemical Society, 157(9), II869, 2010 |
| 10 |
Electrochemical investigation of surface reactions for chemically promoted chemical mechanical polishing of TaN in tartaric acid solutions
Janjam SVSB, Peethala BC, Zheng JP, Babu SV, Roy D
Materials Chemistry and Physics, 123(2-3), 521, 2010 |
