화학공학소재연구정보센터
검색결과 : 19건
No. Article
1 Parametric Study of Plasma Characteristics and Carbon Nanofibers Growth in PECVD System: Numerical Modeling
Gupta R, Sharma SC
Plasma Chemistry and Plasma Processing, 40(5), 1331, 2020
2 Effect of plasma power on the semiconducting behavior of low-frequency PECVD TiO2 and nitrogen-doped TiO2 anodic thin coatings: photo-electrochemical studies in a single compartment cell for hydrogen generation by solar water splitting
Youssef L, Roualdes S, Bassil J, Zakhour M, Rouessac V, Lamy C, Nakhl M
Journal of Applied Electrochemistry, 49(2), 135, 2019
3 Synchronous Polymerization of 3,4-Ethylenedioxythiophene and Pyrrole by Plasma Enhanced Chemical Vapor Deposition (PECVD) for Conductive Thin Film with Tunable Energy Bandgap
Kim SH, Oh JS, Hwang TS, Seo HW, Jeong DC, Lee JH, Wen L, Song CS, Hnag JG, Nam JD
Macromolecular Research, 27(3), 243, 2019
4 Method for measurement of transferred power to plasma in inductive discharges
Hwang HJ, Kim YC, Chung CW
Thin Solid Films, 547, 9, 2013
5 Mode transition of power dissipation and plasma parameters in an asymmetric capacitive discharge
Lee SJ, Lee HC, Bang JY, Oh SJ, Chung CW
Thin Solid Films, 547, 38, 2013
6 Optical Emission Spectroscopy Study and 3-D Surface Characterization of Silicone Rubber Exposed to Different Argon RF Plasma Powers
Chauhan V, Neogi S, Varma A, Guha SK
Journal of Adhesion Science and Technology, 26(10-11), 1313, 2012
7 A study on characterization of atmospheric pressure plasma jets according to the driving frequency for biomedical applications
Seo YS, Lee HW, Kwon HC, Choi J, Lee SM, Woo KC, Kim KT, Lee JK
Thin Solid Films, 519(20), 7071, 2011
8 Effects of gas pressure and plasma power on the growth of carbon nanostructures
Liu YX, Liu JH, Zhu CC, Liu WH
Applied Surface Science, 256(7), 1996, 2010
9 Effect of dielectric barrier discharge on semiconductor Si electrode surface
Wang CQ, Zhang GX, He XN
Applied Surface Science, 256(20), 6047, 2010
10 The effect of air plasma on barrier dielectric surface in dielectric barrier discharge
Wang CQ, Zhang GX, Wang XX, He XN
Applied Surface Science, 257(5), 1698, 2010