1 |
Stressing effects on the charge trapping of silicon oxynitride prepared by thermal oxidation of LPCVD Si-rich silicon nitride Choi HY, Wong H, Filip V, Sen B, Kok CW, Chan M, Poon MC Thin Solid Films, 504(1-2), 7, 2006 |
2 |
Material properties of interfacial silicate layer and its influence on the electrical characteristics of MOS devices using hafnia as the gate dielectric Wong H, Sen B, Filip V, Poon MC Thin Solid Films, 504(1-2), 192, 2006 |
3 |
Current transport and high-field reliability of aluminum/hafnium oxide/silicon structure Sen B, Wong H, Filip V, Choi HY, Sarkar CK, Chan M, Kok CW, Poon MC Thin Solid Films, 504(1-2), 312, 2006 |
4 |
Interface bonding structure of hafniurn oxide prepared by direct sputtering of hafnium in oxygen Wong H, Ng KL, Zhan N, Poon MC, Kok CW Journal of Vacuum Science & Technology B, 22(3), 1092, 2004 |
5 |
Bonding structures of silicon oxynitride prepared by oxidation of Si-rich silicon nitride Poon MC, Kok CW, Wong H, Chan PJ Thin Solid Films, 462-63, 42, 2004 |
6 |
Interface and oxide traps in high-kappa hafnium oxide films Wong H, Zhan N, Ng KL, Poon MC, Kok CW Thin Solid Films, 462-63, 96, 2004 |
7 |
XPS study of the thermal instability of HfO2 prepared by Hf sputtering in oxygen with RTA Zhan N, Poon MC, Kok CW, Ng KL, Wong H Journal of the Electrochemical Society, 150(10), F200, 2003 |
8 |
Study of grain growth of polysilicon formed by nickel-induced-lateral-crystallization of amorphous silicon and subsequent high temperature annealing Qin M, Poon MC, Fan LJ, Chan M, Yuen CY, Chan WY Thin Solid Films, 406(1-2), 17, 2002 |
9 |
Preparation of thin dielectric film for nonvolatile memory by thermal oxidation of Si-rich LPCVD nitride Wong H, Poon MC, Gao Y, Kok TCW Journal of the Electrochemical Society, 148(5), G275, 2001 |
10 |
Resistivity and thermal stability of nickel mono-silicide Poon MC, Deng F, Chan M, Chan WY, Lau SS Applied Surface Science, 157(1-2), 29, 2000 |