화학공학소재연구정보센터
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No. Article
1 Magnetron sputtering modes during pulsed deposition process determined by the analysis of power supply parameter
Krowka K, Wiatrowski A, Posadowski WM
Thin Solid Films, 520(12), 4127, 2012
2 Pulsed dc self-sustained magnetron sputtering
Wiatrowski A, Posadowski WM, Radzimski ZJ
Journal of Vacuum Science & Technology A, 26(5), 1277, 2008
3 Magnetron sputtering process control by medium-frequency power supply parameter
Posadowski WM, Wiatrowski A, Dora J, Radzimski ZJ
Thin Solid Films, 516(14), 4478, 2008
4 Self-sustained magnetron co-sputtering of Cu and Ni
Posadowski WM
Thin Solid Films, 459(1-2), 258, 2004
5 Plasma parameters of very high target power density magnetron sputtering
Posadowski WM
Thin Solid Films, 392(2), 201, 2001
6 Pulsed magnetron sputtering of reactive compounds
Posadowski WM
Thin Solid Films, 343-344, 85, 1999
7 Directional copper deposition using dc magnetron self-sputtering
Radzimski ZJ, Posadowski WM, Rossnagel SM, Shingubara S
Journal of Vacuum Science & Technology B, 16(3), 1102, 1998