검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Patterning of porous SiOCH using an organic mask: Comparison with a metallic masking strategy Darnon M, Chevolleau T, David T, Ducote J, Posseme N, Bouyssou R, Bailly F, Perret D, Joubert O Journal of Vacuum Science & Technology B, 28(1), 149, 2010 |
| 2 |
Scatterometric porosimetry: A new characterization technique for porous material patterned structures Bouyssou R, El Kodadi M, Licitra C, Chevolleau T, Besacier M, Posseme N, Joubert O, Schiavone P Journal of Vacuum Science & Technology B, 28(4), L31, 2010 |
| 3 |
Residue growth on metallic-hard mask after dielectric etching in fluorocarbon-based plasmas. I. Mechanisms Posseme N, Chevolleau T, Bouyssou R, David T, Arnal V, Barnes JP, Verove C, Joubert O Journal of Vacuum Science & Technology B, 28(4), 809, 2010 |
| 4 |
Modifications of dielectric films induced by plasma ashing processes: Hybrid versus porous SiOCH materials Darnon M, Chevolleau T, David T, Posseme N, Ducote J, Licitra C, Vallier L, Joubert O, Torres J Journal of Vacuum Science & Technology B, 26(6), 1964, 2008 |
| 5 |
Analyses of chamber wall coatings during the patterning of ultralow-k materials with a metal hard mask: Consequences on cleaning strategies Chevolleau T, Darnon M, David T, Posseme N, Torres J, Joubert O Journal of Vacuum Science & Technology B, 25(3), 886, 2007 |
| 6 |
Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas Posseme N, Chevolleau T, David T, Darnon M, Louveau O, Joubert O Journal of Vacuum Science & Technology B, 25(6), 1928, 2007 |
| 7 |
A novel low-damage methane-based plasma ash chemistry (CH4/Ar): Limiting metal barrier diffusion into porous low-kappa materials Posseme N, David T, Chevolleau T, Joubert O Electrochemical and Solid State Letters, 8(5), G112, 2005 |
| 8 |
Resist-pattern transformation studied by x-ray photoelectron spectroscopy after exposure to reactive plasmas. I. Methodology and examples Pargon E, Joubert O, Posseme N, Vallier L Journal of Vacuum Science & Technology B, 22(4), 1858, 2004 |
| 9 |
Etching of porous SiOCH materials in fluorocarbon-based plasmas Posseme N, Chevolleau T, Joubert O, Vallier L, Rochat N Journal of Vacuum Science & Technology B, 22(6), 2772, 2004 |
| 10 |
Etching mechanisms of low-k SIOCH and selectivity to SiCH and SiO2 in fluorocarbon based plasmas Posseme N, Chevolleau T, Joubert O, Vallier L Journal of Vacuum Science & Technology B, 21(6), 2432, 2003 |