검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation Prasad YN, Kwon TY, Kim IK, Kim IG, Park JG Journal of the Electrochemical Society, 158(4), H394, 2011 |
| 2 |
Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning Kim IK, Prasad YN, Kwon TY, Kim HM, Busnaina AA, Park JG Journal of the Electrochemical Society, 158(10), H1052, 2011 |
| 3 |
Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry Kang YJ, Prasad YN, Kim IK, Jung SJ, Park JG Journal of Colloid and Interface Science, 349(1), 402, 2010 |
| 4 |
Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization Choi JG, Prasad YN, Kim IK, Kim IG, Kim WJ, Busnaina AA, Park JG Journal of the Electrochemical Society, 157(2), H186, 2010 |
| 5 |
The Synergetic Role of Pores and Grooves of the Pad on the Scratch Formation during STI CMP Choi JG, Prasad YN, Kim IK, Kim WJ, Park JG Journal of the Electrochemical Society, 157(8), H806, 2010 |
| 6 |
Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP Park JG, Prasad YN, Kang YJ, Kim IK, Hong YK, Han SY, Yun SK, Yoon BU, Busnaina AA Journal of the Electrochemical Society, 156(11), H869, 2009 |
| 7 |
Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor Prasad YN, Ramanathan S Electrochimica Acta, 52(22), 6353, 2007 |
| 8 |
Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP Prasad YN, Ramanathan S Electrochemical and Solid State Letters, 9(12), G337, 2006 |