검색결과 : 32건
| No. | Article |
|---|---|
| 1 |
Are all membrane reactors equal from an environmental point of view? Hospido A, Sanchez I, Rodriguez-Garcia G, Iglesias A, Buntner D, Reif R, Moreira MT, Feijoo G Desalination, 285, 263, 2012 |
| 2 |
Fate of pharmaceuticals and cosmetic ingredients during the operation of a MBR treating sewage Reif R, Suarez S, Omil F, Lema JM Desalination, 221(1-3), 511, 2008 |
| 3 |
Purification and enzymological characterization of murine neurotrypsin Reif R, Sales S, Dreier B, Luscher D, Wofel J, Gisler C, Baici A, Kunz B, Sonderegger P Protein Expression and Purification, 61(1), 13, 2008 |
| 4 |
Low-temperature direct CVD oxides to thermal oxide wafer bonding in silicon layer transfer Tan CS, Chen KN, Fan A, Reif R Electrochemical and Solid State Letters, 8(1), G1, 2005 |
| 5 |
Silicon multilayer stacking based on copper wafer bonding Tan CS, Reif R Electrochemical and Solid State Letters, 8(6), G147, 2005 |
| 6 |
Microelectronics thin film handling and transfer using low-temperature wafer bonding Tan CS, Reif R Electrochemical and Solid State Letters, 8(12), G362, 2005 |
| 7 |
Morphology and bond strength of copper wafer bonding Chen KN, Tan CS, Fan A, Reif R Electrochemical and Solid State Letters, 7(1), G14, 2004 |
| 8 |
Low temperature growth of homoepitaxial film on Si substrate cleaned in-situ by ECR hydrogen plasma Kim HW, Hwang WS, Lee C, Reif R Journal of Materials Science Letters, 22(13), 939, 2003 |
| 9 |
Plasma cleaning of carbon species for silicon homoepitaxial growth Kim HW, Hwang WS, Lee C, Reif R Journal of Materials Science Letters, 22(15), 1067, 2003 |
| 10 |
Interfacial morphologies and possible mechanisms of copper wafer bonding Chen KN, Fan A, Reif R Journal of Materials Science, 37(16), 3441, 2002 |