화학공학소재연구정보센터
검색결과 : 8건
No. Article
1 Evidence for Network Evolution in an Arabidopsis Interactome Map
Braun P, Carvunis AR, Charloteaux B, Dreze M, Ecker JR, Hill DE, Roth FP, Vidal M, Galli M, Balumuri P, Bautista V, Chesnut JD, Kim RC, de los Reyes C, Gilles P, Kim CJ, Matrubutham U, Mirchandani J, Olivares E, Patnaik S, Quan R, Ramaswamy G, Shinn P, Swamilingiah GM, Wu S, Ecker JR, Dreze M, Byrdsong D, Dricot A, Duarte M, Gebreab F, Gutierrez BJ, MacWilliams A, Monachello D, Mukhtar MS, Poulin MM, Reichert P, Romero V, Tam S, Waaijers S, Weiner EM, Vidal M, Hill DE, Braun P, Galli M, Carvunis AR, Cusick ME, Dreze M, Romero V, Roth FP, Tasan M, Yazaki J, Braun P, Ecker JR, Carvunis AR, Ahn YY, Barabasi AL, Charloteaux B, Chen HM, Cusick ME, Dangl JL, Dreze M, Ecker JR, Fan CY, Gai LT, Galli M, Ghoshal G, Hao T, Hill DE, Lurin C, Milenkovic T, Moore J, Mukhtar MS, Pevzner SJ, Przulj N, Rabello S, Rietman EA, Rolland T, Roth FP, Santhanam B, Schmitz RJ, Spooner W, Stein J, Tasan M, Vandenhaute J, Ware D, Braun P, Vidal M, Braun P, Carvunis AR, Charloteaux B, Dreze M, Galli M, Vidal M
Science, 333(6042), 601, 2011
2 Mapping of wafer profile to plasma processing conditions: Forward and reverse maps
Lane J, Rietman EA, Layadi N, Lee JTC
Journal of Vacuum Science & Technology B, 18(1), 299, 2000
3 Use of orthogonal polynomial functions for endpoint detection during plasma etching of patterned wafers
Rietman EA, Layadi N, Downey SW
Journal of Vacuum Science & Technology B, 18(5), 2500, 2000
4 Dynamic images of plasma processes : Use of Fourier blobs for endpoint detection during plasma etching of patterned wafers
Rietman EA, Lee JTC, Layadi N
Journal of Vacuum Science & Technology A, 16(3), 1449, 1998
5 Preliminary empirical results suggesting the mapping of dynamic in situ process signals to real-time wafer attributes in a plasma etch process
Rietman EA, Ibbotson DE, Lee JTC
Journal of Vacuum Science & Technology B, 16(1), 131, 1998
6 A new algorithm for real-time thin film thickness estimation given in situ multiwavelength ellipsometry using an extended Kalman filter
Galarza CG, Khargonekar PP, Layadi N, Vincent TL, Rietman EA, Lee JTC
Thin Solid Films, 313-314, 156, 1998
7 Plasma-Etching Endpointing by Monitoring Radiofrequency Power-Systems with an Artificial Neural-Network
Maynard HL, Rietman EA, Lee JT, Ibbotson DE
Journal of the Electrochemical Society, 143(6), 2029, 1996
8 Neural Networks in Plasma Processing
Rietman EA
Journal of Vacuum Science & Technology B, 14(1), 504, 1996