검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Monitoring the Superfilling of Blind Holes with Electrodeposited Copper Luhn O, Radisic A, Van Hoof C, Ruythooren W, Celis JP Journal of the Electrochemical Society, 157(4), D242, 2010 |
| 2 |
Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration Luhn O, Radisic A, Vereecken PM, Van Hoof C, Ruythooren W, Celis JP Electrochemical and Solid State Letters, 12(5), D39, 2009 |
| 3 |
Filling of microvia with an aspect ratio of 5 by copper electrodeposition Luhn O, Van Hoof C, Ruythooren W, Celis JP Electrochimica Acta, 54(9), 2504, 2009 |
| 4 |
Microstructural investigation of Co-P by TEM Ruythooren W, De Boeck J, Celis JP Journal of the Electrochemical Society, 151(5), C315, 2004 |