검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 degrees C He R, Fujino M, Akaike M, Sakai T, Sakuyama S, Suga T Applied Surface Science, 414, 163, 2017 |