화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging. Influence of a thiourea additive on the kinetics of roughening and brightening
Mendez S, Andreasen G, Schilardi P, Figueroa M, Vazquez L, Salvarezza RC, Arvia AJ
Langmuir, 14(9), 2515, 1998
2 Evolution of the growth front for copper electrodeposition followed by real time imaging
Schilardi P, Mendez S, Salvarezza RC, Arvia AJ
Langmuir, 14(15), 4308, 1998
3 Topographic Changes of Polycrystalline Ag and Cu Electrodes in Acid Aqueous-Solutions Resulting from a Prolonged Application of the Potential Reversal Technique
Carro P, Creus AH, Schilardi P, Gonzalez S, Salvarezza RC, Arvia AJ
Journal of the Electrochemical Society, 143(7), 2294, 1996