| 1 |
Solvent-resistant photocurable "liquid teflon" for microfluidic device fabrication
Rolland JP, Van Dam RM, Schorzman DA, Quake SR, DeSimone JM
Journal of the American Chemical Society, 126(8), 2322, 2004 |
| 2 |
Solvent resistant photocurable "liquid teflon" for microfluidic device fabrication (vol 126, pg 2322, 2004)
Rolland JP, Van Dam RM, Schorzman DA, Quake SR, DeSimone JM
Journal of the American Chemical Society, 126(26), 8349, 2004 |
| 3 |
Accelerated curing of aryl-ethynyl end-capped polyimide oligomers and model compounds: A kinetic study probing substituent effects
Wright ME, Schorzman DA, Berman AM
Macromolecules, 35(17), 6550, 2002 |
| 4 |
Synthesis and thermal cure of anthracenyl-ethynyl end-capped imide oligomers
Wright ME, Schorzman DA
Macromolecules, 34(14), 4768, 2001 |
| 5 |
Thermally curing aryl-ethynyl end-capped imide oligomers: Study of new aromatic end caps
Wright ME, Schorzman DA, Pence LE
Macromolecules, 33(23), 8611, 2000 |
| 6 |
A fast thermally curing naphthyl-ethynyl imide
Wright ME, Schorzman DA
Macromolecules, 32(25), 8693, 1999 |
