검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements Schreck T, Schnorpfeil A, Kaloudis M Journal of Materials Science, 48(6), 2479, 2013 |
| 2 |
Interfacial reactions between Sn-57Bi-1Ag solder and electroless Ni-P/immersion Au under solid-state aging Fuchs C, Schreck T, Kaloudis M Journal of Materials Science, 47(9), 4036, 2012 |