검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages Sham ML, Kim JK Journal of Applied Polymer Science, 96(1), 175, 2005 |
| 2 |
Adhesion characteristics of underfill resins with flip chip package components Sham ML, Kim JK Journal of Adhesion Science and Technology, 17(14), 1923, 2003 |
| 3 |
Effects of surface treatment and weave structure on interlaminar fracture behaviour of plain glass woven fabric composites: Part II. Report of the 2nd round robin test results Kim JK, Sham ML, Hamada H, Hirai Y, Fujihara K, Saidpour H, Sezen M, Krawczak P, Bequignat R, Pabiot J, Pinter S, Banhegyl G, Yue CY, Padmanabhan K, Suzuki Y, Schulte K, Karger-Kocsis JK, Ye L, Lesko JJ Composite Interfaces, 9(2), 207, 2002 |
| 4 |
Effect of hybrid layers with different silane coupling agents on impact response of glass fabric reinforced vinylester matrix composites Kim JK, Sham ML, Sohn MS, Hamada H Polymer, 42(17), 7455, 2001 |
| 5 |
Effect of surface treatment on mode I interlaminar fracture behaviour of plain glass woven fabric composites: Part I. Report of the 2nd round-robin test results Kim JK, Sham ML, Hamada H, Hirai Y, Fujihara K, Saidpour H, Sezen M, Dong YJ, Yang HS, Bai YL, Mao TX, Bathias C, Hoa SV, Boutella A, Ngo AD, Krawczak P, Bequignat R, Pabiot J, Pinter S, Banhegyi G, Drzal LT, Ho H, Yue CY, Padmanabhan K, Suzuki Y, Tanimoto T, Schulte K, Karger-Kocsis JK, Cantwell WJ, Zulkitli R, Ye L, Lesko JJ, Garcia K Composite Interfaces, 7(3), 227, 2000 |